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3D Technology for Advanced Sensor Systems

A collaboration between our group, RTI International (RTI) and North Carolina State University (NCSU) and includes work in the following areas: advanced metal-metal interconnects, development of process technology for through silicon interconnects, 3D passives, and applications of through silicon vias (TSV) to advanced sensors

Through Wafer Interconnects


  • Through-wafer interconnect reliability
  • Continuity and void detection
  • Plasma induced damage (PID)
  • Environmental reliability
  • TWI Applications
  • Device applications & 3D microstructures


Graduate Students

*: 2003 Micron Campus Engineering Research Program (undergraduate summer research)
+: Awarded Best Research Poster-College of Engineering at 2004 Boise State University Undergraduate Research Conference